Quality Testing

PCBA potting should be reviewed before quoting, not added as a late finishing note. This checklist covers the mechanical, layout, masking, test, and documentation details that help avoid rework and unclear production assumptions.

Selecting a PCBA potting material is not a simple chemistry choice. This guide helps engineering and sourcing teams compare epoxy, polyurethane, and silicone against the product environment, repair strategy, manufacturing process, and validation plan.

Potting and conformal coating both protect PCB assemblies, but they solve different problems. This guide explains how engineering and sourcing teams can select the right protection strategy before quoting or production.

Bubbles in potted PCB assemblies can affect appearance, coverage, insulation, and validation. This guide explains common causes, the limits of vacuum potting, practical process controls, and the acceptance criteria teams should define early.

This guide explains the real manufacturing factors behind PCBA potting: different resin types, equipment cleaning before material changeover, vacuum degassing capability, dust control, dispensing trials, and multi-stage curing.

This guide explains AOI inspection in PCBA in practical manufacturing terms. It covers visible defect detection, hidden-joint limits, layout and process factors, and how OEM teams should discuss AOI scope with a PCB assembly supplier.

This guide explains ICT vs FCT vs AOI in a practical way for OEM teams and sourcing managers. It covers inspection versus electrical verification, fixture tradeoffs, coverage limits, and how to choose a sensible test mix before quoting or production.