PCB Via Current Calculator
Calculate maximum current capacity for PCB vias based on IPC-2152 standards
PCB Via Current Calculator
Estimate how much current a plated via can safely carry, compare parallel via capacity, and review via resistance before final fabrication review.
Finished hole diameter (0.2mm - 1.0mm typical)
Standard: 25μm, Heavy copper: 50μm+
Via Cross-Section
D = Diameter, T = Plating Thickness
When to use this calculator
Use it when current has to move between layers and you need to estimate whether one via or a via array can safely carry the expected load.
Check how many vias you may need in parallel when routing high-current paths through thick boards or compact layouts.
Use the estimate as an engineering review input when discussing plating thickness, finished hole size, and reliability with your fabricator.
Key Features
IPC-Based Calculation
Uses proven IPC-2152/2221 formulas for accurate current capacity estimation based on thermal constraints.
Parallel Via Support
Calculate total current capacity for multiple vias in parallel, essential for high-current power designs.
Resistance Calculation
Also calculates via resistance to help you estimate voltage drop and power dissipation.
Related resources & next steps
Estimate current capacity for the connected traces after validating how current moves through vias.
Check whether the trace connected to the via array is also wide enough for the expected load.
Review via plating, aspect ratio, and fabrication constraints with manufacturing support.
Send your via structure, current requirement, and stackup details for engineering review.
Frequently Asked Questions
What is the standard via plating thickness?
Standard via plating thickness is typically 25μm (1 mil). For high-current applications, manufacturers can plate up to 50μm or more. The IPC-A-600 Class 2 standard requires a minimum of 20μm average plating thickness.
How many vias do I need for high-current traces?
Use this calculator to determine current per via, then divide your required current by this value. Always add a safety margin of 20-50%. For example, if each via can carry 1A and you need 5A, use at least 6-8 vias.
What temperature rise should I use?
A 10°C rise is conservative and commonly used. For designs with good thermal management or short duty cycles, 20°C may be acceptable. Never exceed 45°C rise as this approaches solder reflow temperatures.
Are blind and buried vias different?
The calculation method is the same, but via length differs. For blind vias, use the actual via depth instead of full board thickness. Buried vias should use the distance between connected layers.
Need help validating via current capacity in a real production stackup?
If your design depends on heavy current transfer, stacked vias, or challenging thermal conditions, we can review manufacturability, plating assumptions, and reliability before fabrication.