PCB Via Current Calculator
Calculate maximum current capacity for PCB vias based on IPC-2152 standards
Finished hole diameter (0.2mm - 1.0mm typical)
Standard: 25μm, Heavy copper: 50μm+
Via Cross-Section
D = Diameter, T = Plating Thickness
Key Features
IPC-Based Calculation
Uses proven IPC-2152/2221 formulas for accurate current capacity estimation based on thermal constraints.
Parallel Via Support
Calculate total current capacity for multiple vias in parallel, essential for high-current power designs.
Resistance Calculation
Also calculates via resistance to help you estimate voltage drop and power dissipation.
Common Use Cases
Power Distribution Design
Determine how many vias are needed to safely transfer power between layers in your PCB design.
Thermal Management
Ensure vias won't overheat under maximum load conditions by calculating safe current limits.
High-Current Applications
Design motor drivers, power supplies, and battery management systems with confidence.
Design Verification
Validate existing designs meet IPC standards before committing to PCB fabrication.
How to Use This Calculator
Enter Via Diameter
Input the finished hole diameter of your via in millimeters.
Set Plating Thickness
Enter the copper plating thickness (typically 18-50μm).
Configure Parameters
Set number of vias, board thickness, and acceptable temperature rise.
Get Results
Click calculate to see max current per via and total capacity.
Benefits of Via Current Calculation
- Prevent PCB failures from via overheating
- Optimize via count for cost and space efficiency
- Ensure compliance with IPC standards
- Reduce design iterations and prototyping costs
Why Engineers Love This Tool
Simple & Intuitive
Clean interface with all the essential parameters. No complex setup required.
Visual Feedback
Cross-section diagram helps visualize via geometry and understand the calculation.
Free & No Registration
Use instantly without creating an account. Your data stays in your browser.
Frequently Asked Questions
What is the standard via plating thickness?
Standard via plating thickness is typically 25μm (1 mil). For high-current applications, manufacturers can plate up to 50μm or more. The IPC-A-600 Class 2 standard requires a minimum of 20μm average plating thickness.
How many vias do I need for high-current traces?
Use this calculator to determine current per via, then divide your required current by this value. Always add a safety margin of 20-50%. For example, if each via can carry 1A and you need 5A, use at least 6-8 vias.
What temperature rise should I use?
A 10°C rise is conservative and commonly used. For designs with good thermal management or short duty cycles, 20°C may be acceptable. Never exceed 45°C rise as this approaches solder reflow temperatures.
Are blind and buried vias different?
The calculation method is the same, but via length differs. For blind vias, use the actual via depth instead of full board thickness. Buried vias should use the distance between connected layers.