
厚铜
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厚铜
厚铜PCB
具有厚铜层的大电流板,用于电力电子
主要特点
大电流
每条线路高达20A
厚铜
3-10 oz 铜厚
热管理
优异的散热性能
电力应用
工业电源系统
技术规格
| 铜厚 | 3-10 oz (105-350μm) |
| 电流容量 | 最高 20A |
| 层数 | 2-20 层 |
| 厚度 | 1.6mm - 6.0mm |
| 应用 | 电源, 电机驱动 |
工程注意事项
报价前的制造审查
Heavy copper designs should be reviewed against current capacity, thermal spreading, copper distribution, etching limits, drill capability, and the final assembly process before the stackup is fixed.
- Confirm finished copper weight, current target, allowable temperature rise, and whether the quoted value is starting foil or finished copper.
- Review via count, hole size, plating, copper balance, and thermal paths where high-current nets change layers.
- Share board thickness, isolation, terminal style, and assembly requirements because heavy copper changes drilling, etching, soldering, and panel planning.
典型应用
电源, 电机驱动