厚銅基板

エンジニアリング上の確認事項

見積り前の製造レビュー

Heavy copper designs should be reviewed against current capacity, thermal spreading, copper distribution, etching limits, drill capability, and the final assembly process before the stackup is fixed.

• Confirm finished copper weight, current target, allowable temperature rise, and whether the quoted value is starting foil or finished copper.
• Review via count, hole size, plating, copper balance, and thermal paths where high-current nets change layers.
• Share board thickness, isolation, terminal style, and assembly requirements because heavy copper changes drilling, etching, soldering, and panel planning.