BGA Assembly

X-ray inspection in PCBA helps teams review hidden solder joints, bottom-terminated packages, BGA assembly quality, and internal board structures that AOI cannot see directly. This guide explains when x-ray review adds value, what it cannot prove by itself, and how to prepare a better inspection discussion before prototype or production build.

Explore the complexities of BGA assembly, common challenges in manufacturing, and how SUNTOP Electronics delivers reliable BGA solutions with advanced quality control and precision processes.