Dickkupfer-PCB

Technische Überlegungen

Fertigungsprüfung vor dem Angebot

Heavy copper designs should be reviewed against current capacity, thermal spreading, copper distribution, etching limits, drill capability, and the final assembly process before the stackup is fixed.

• Confirm finished copper weight, current target, allowable temperature rise, and whether the quoted value is starting foil or finished copper.
• Review via count, hole size, plating, copper balance, and thermal paths where high-current nets change layers.
• Share board thickness, isolation, terminal style, and assembly requirements because heavy copper changes drilling, etching, soldering, and panel planning.