Fertigungskapazitäten
Fortschrittliche Fertigungskapazitäten mit moderner Ausrüstung, strenger Qualitätskontrolle und erfahrenen technischen Teams.
Produktionsexzellenz
Leistungskennzahlen für eine erstklassige Fertigung
Technische Fähigkeiten
Umfassende Spezifikationen und Möglichkeiten für PCB- und PCBA-Fertigung
Technical Capabilities
PCB Layer Count
1-32 layersFrom simple single-layer to complex HDI designs
Minimum Trace Width
0.075mm (3mil)Fine pitch capability for dense layouts
Via Size
0.1mm minimumMicro via and blind via technology
Board Size
0.2" x 0.2" to 20" x 28"Flexible sizing for various applications
Assembly Capabilities
Component Size
01005 to large connectorsUltra-fine pitch SMT assembly
Placement Accuracy
±0.02mmHigh precision component placement
BGA Pitch
0.4mm minimumFine pitch BGA and uBGA assembly
Lead Count
Up to 2000+ pinsComplex high-density packages
Quality Control
AOI Coverage
100% inspectionAutomated optical inspection on all assemblies
X-ray Inspection
2D/3D capabilityHidden solder joint inspection
ICT Testing
Full coverageIn-circuit testing for all critical nets
Functional Test
Custom fixturesApplication-specific testing protocols
Production Capacity
SMT Lines
12 production linesHigh-speed surface mount technology
Daily Capacity
50,000+ assembliesScalable production volumes
Lead Time
3-15 daysQuick turn and standard production
Shift Coverage
24/7 operationsRound-the-clock production capability
Ausrüstung & Technologie
Moderne Fertigungsanlagen und Inspektionssysteme
SMT Equipment
Yamaha YSM20R
High-speed mounter152,000 CPH, 0.05mm accuracy
Panasonic NPM-W2
Modular mounter34,000 CPH, 01005 capability
JUKI KE-3020VL
Flexible mounterLED strips, odd-form components
Heller 1936 MKIII
Reflow oven10-zone convection, nitrogen capable
Inspection Equipment
Omron VT-M51
3D AOI systemFull 3D inspection, color analysis
Nordson DAGE XD7600NT
X-ray system2D/3D imaging, void analysis
Teradyne TestStation
ICT testerHigh-speed parallel testing
Keysight i3070
ICT systemBoundary scan, vector testing
PCB Fabrication
Via Drilling
Mechanical/Laser0.1-6.0mm diameter capability
Plating Lines
AutomatedCopper, HASL, ENIG, OSP finishes
Lamination Press
Vacuum pressMulti-layer stack-up to 32 layers
LDI Imaging
Laser direct2µm resolution, fine line capability
Qualitätsstandards & Zertifizierungen
International anerkannte Qualitätsmanagementsysteme
ISO 9001:2015
Quality Management System
Design, development, and production of PCBs and assemblies
ISO 14001:2015
Environmental Management
Environmental protection and sustainable manufacturing
UL Listing
Safety Standards
Electrical safety and fire resistance testing
RoHS Compliance
Restriction of Hazardous Substances
Lead-free and environmentally safe processes
Fertigungsprozess
Optimierter Ablauf vom Design bis zur Lieferung
Design Review
Design review and optimization recommendations
Material Procurement
Component sourcing and quality verification
PCB Fabrication
Multi-layer stack-up and surface finishing
SMT Assembly
Pick and place with precision placement
Through-hole
DIP insertion and wave/selective soldering
Testing & QC
AOI, ICT, functional, and final inspection
Packaging
ESD protection and secure shipping
Bereit, unsere Fähigkeiten zu nutzen?
Unser technisches Team prüft Ihre Projektanforderungen und empfiehlt passende Fertigungsoptionen.