PCB HDI
(76 reviews)
PCB HDI
PCB HDI
PCB Interkoneksi Kepadatan Tinggi untuk perangkat elektronik canggih
Key Features
Micro Vias
Via bor laser < 0.15mm
Garis Halus
Jalur/Spasi < 0.075mm
Integritas Sinyal Tinggi
Dioptimalkan untuk kecepatan tinggi
Desain Ringkas
Lebih banyak fungsionalitas di ruang yang lebih sedikit
Specifications
| Jumlah Lapisan | 4-30 lapis |
| Teknologi Via | Buta, Terkubur, Mikro |
| Rasio Aspek | Hingga 10:1 |
| Min Jalur/Spasi | 0.05mm/0.05mm |
| Material | High Tg FR4 |
Pertimbangan engineering
Tinjauan manufaktur sebelum penawaran
HDI boards need fabrication and assembly decisions to stay linked. A realistic stackup and via strategy should be reviewed before the layout is frozen.
- Confirm layer count, microvia structure, sequential lamination, via-in-pad requirements, and the escape strategy around fine-pitch packages.
- Review stackup, impedance-sensitive layers, copper balance, registration, solder mask, and inspection access before release.
- Align the fabrication build with BGA assembly, X-ray or AOI coverage, test access, and the product reliability stage.