PCB HDI
(76 recensioni)
PCB HDI
PCB HDI
PCB ad Alta Densità di Interconnessione per dispositivi elettronici avanzati
Caratteristiche principali
Micro Vias
Vias forate al laser < 0.15mm
Linee Sottili
Traccia/Spazio < 0.075mm
Alta Integrità Segnale
Ottimizzato per alta velocità
Design Compatto
Più funzionalità in meno spazio
Specifiche
| Numero strati | 4-30 strati |
| Tecnologia Via | Cieco, Sepolto, Micro |
| Rapporto Formale | Fino a 10:1 |
| Min Traccia/Spazio | 0.05mm/0.05mm |
| Materiale | Alto Tg FR4 |
Engineering considerations
Manufacturing review before quote
HDI boards need fabrication and assembly decisions to stay linked. A realistic stackup and via strategy should be reviewed before the layout is frozen.
- Confirm layer count, microvia structure, sequential lamination, via-in-pad requirements, and the escape strategy around fine-pitch packages.
- Review stackup, impedance-sensitive layers, copper balance, registration, solder mask, and inspection access before release.
- Align the fabrication build with BGA assembly, X-ray or AOI coverage, test access, and the product reliability stage.