HDI PCB
(76 omdömen)
HDI PCB
HDI PCB
High Density Interconnect PCB:er för avancerade elektroniska enheter
Viktiga egenskaper
Micro Vias
Laserborrade vior < 0.15mm
Fina linjer
Spår/Mellanrum < 0.075mm
Hög signalintegritet
Optimerad för hög hastighet
Kompakt design
Mer funktionalitet på mindre yta
Specifikationer
| Antal lager | 4-30 lager |
| Via-teknik | Blind, Begravd, Mikro |
| Aspektförhållande | Upp till 10:1 |
| Min spår/mellanrum | 0.05mm/0.05mm |
| Material | Hög Tg FR4 |
Engineering considerations
Manufacturing review before quote
HDI boards need fabrication and assembly decisions to stay linked. A realistic stackup and via strategy should be reviewed before the layout is frozen.
- Confirm layer count, microvia structure, sequential lamination, via-in-pad requirements, and the escape strategy around fine-pitch packages.
- Review stackup, impedance-sensitive layers, copper balance, registration, solder mask, and inspection access before release.
- Align the fabrication build with BGA assembly, X-ray or AOI coverage, test access, and the product reliability stage.