HDI PCB
(76 reviews)
HDI PCB
HDI PCB
Høy tetthet interconnect PCB-er for avanserte elektroniske enheter
Key Features
Micro Vias
Laserboret vias < 0.15mm
Fine linjer
Spor/Mellomrom < 0.075mm
Høy signalintegritet
Optimalisert for høy hastighet
Kompakt design
Mer funksjonalitet på mindre plass
Specifications
| Antall lag | 4-30 lag |
| Via-teknologi | Blind, Begravd, Mikro |
| Sideforhold | Opptil 10:1 |
| Min Spor/Mellomrom | 0.05mm/0.05mm |
| Materiale | Høy Tg FR4 |
Engineering considerations
Manufacturing review before quote
HDI boards need fabrication and assembly decisions to stay linked. A realistic stackup and via strategy should be reviewed before the layout is frozen.
- Confirm layer count, microvia structure, sequential lamination, via-in-pad requirements, and the escape strategy around fine-pitch packages.
- Review stackup, impedance-sensitive layers, copper balance, registration, solder mask, and inspection access before release.
- Align the fabrication build with BGA assembly, X-ray or AOI coverage, test access, and the product reliability stage.