HDI PCB
(76 reviews)
HDI PCB
HDI PCB
High Density Interconnect PCB's voor geavanceerde elektronische apparaten
Key Features
Micro Vias
Laser geboorde vias < 0.15mm
Fijne Lijnen
Spoor/Ruimte < 0.075mm
Hoge Signaalintegriteit
Geoptimaliseerd voor hoge snelheid
Compact Ontwerp
Meer functionaliteit in minder ruimte
Specifications
| Aantal lagen | 4-30 lagen |
| Via Technologie | Blind, Begraven, Micro |
| Aspect Ratio | Tot 10:1 |
| Min Spoor/Ruimte | 0.05mm/0.05mm |
| Materiaal | Hoog Tg FR4 |
Technische aandachtspunten
Productiebeoordeling vóór de offerte
HDI boards need fabrication and assembly decisions to stay linked. A realistic stackup and via strategy should be reviewed before the layout is frozen.
- Confirm layer count, microvia structure, sequential lamination, via-in-pad requirements, and the escape strategy around fine-pitch packages.
- Review stackup, impedance-sensitive layers, copper balance, registration, solder mask, and inspection access before release.
- Align the fabrication build with BGA assembly, X-ray or AOI coverage, test access, and the product reliability stage.